Introduction to system-on-package (SOP: miniaturization of the entire system

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Publisher:
McGraw-Hill,
Pub. Date:
[2008]
Language:
English
Description
System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
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Grouping Information

Grouped Work ID b95f363d-f059-f1e3-c90f-7bae535832c8
Grouping Title introduction to system on package sop miniaturization of the entire system
Grouping Author tummala rao r
Grouping Category book
Last Grouping Update 2018-08-06 04:40:45AM
Last Indexed 2018-08-14 04:58:19AM

Solr Details

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author Tummala, Rao R., 1942-
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series McGraw Hill professional
series_with_volume McGraw Hill professional|
subject_facet Microelectronic packaging, Multichip modules (Microelectronics) -- Design
title_display Introduction to system-on-package (SOP : miniaturization of the entire system
title_full Introduction to system-on-package (SOP : miniaturization of the entire system / Rao R. Tummala, Madhavan Swaminathan
title_short Introduction to system-on-package (SOP :
title_sub miniaturization of the entire system